Microchannel Heat Sink Thermal Resistance

Their efforts have been aimed at presenting an optimized structure for the microchannel heat sink.

Microchannel heat sink thermal resistance.

In most cases the single phase flow inside minichannels is a laminar flow. V 2005 analysis and optimization of the thermal performance of microchannel heat sinks international journal for numerical methods in heat and fluid flow vol. 7 26 zbmath crossref google scholar. Normally convection is the dominant factor for reducing the thermal resistance when highly conductive material is used to fabricate the heat sinks.

A thermal resistance model was set up to analyse the flow and heat transfer in microchannel heat sinks. Abstract to meet the intensifying demands of electronics cooling the current study proposes an open manifold microchannel heat sink which substantially reduces the pressure drop of a conventional manifold microchannel heat sink while retaining a low thermal resistance thin profile 2 mm and planar geometry suited to microfabrication. Laminar turbulent developed and developing flow and heat transfer were considered in the analysis.